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Ordering number : EN5331
Wideband Output Module (video pack)
VP513
CRT Display Video Output Amplifier: High-Voltage, Wideband Amplification
Features
* Low power dissipation class A amp: 6.5W with 25 MHz (clock) * Bandwidth f (-3 dB) = 70 MHz * Pulse response (tr, tf) tr = 5.8 ns (typ) and tf = 5.0 ns (typ) at 40 Vp-p swing * Plastic mold package for excellent reliability
Package Dimensions
unit: mm 2117
[VP513]
Specifications
Absolute Maximum Ratings at Ta = 25C
Parameter Maximum supply voltage Allowable power dissipation Junction temperature Case temperature Storage temperature Symbol VCC max VBB max Pd max Tj max Tc max Tstg At Tc = 25C with an ideal heat sink Conditions Ratings 90 15 25 150 100 -20 to +110 Unit V V W C C C
Operating Conditions at Ta = 25C
Parameter Recommended supply voltage I Symbol VCC VBB VCC VBB Conditions Ratings 70 10 80 10 Unit V V V V
Recommended supply voltage II
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53096HA (OT) No. 5331-1/8
VP513 Electrical Characteristics at Ta = 25C
Parameter Bandwidth I (-3 dB) Bandwidth II (-3 dB) Pulse response characteristics Voltage gain Symbol fc fc tr tf GV (DC) ICC1 Current drain I ICC2 ICC1 Current drain II ICC2 VCC = 70 V, VBB = 10 V, VIN (DC) = 2.6 V, f = 10 MHz clock, CL = 5 pF, VOUT (p-p) = 40 V VCC = 70 V, VBB = 10 V, VIN (DC) = 2.6 V, f = 70 MHz clock, CL = 5 pF, VOUT (p-p) = 40 V VCC = 80 V, VBB = 10 V, VIN (DC) = 2.9 V, f = 10 MHz clock, CL = 5 pF, VOUT (p-p) = 50 V VCC = 80 V, VBB = 10 V, VIN (DC) = 2.9 V, f = 70 MHz clock, CL = 5 pF, VOUT (p-p) = 50 V Conditions VCC = 70 V, VBB = 10 V, CL = 5 pF, VIN (DC) = 2.6 V, VOUT (p-p) = 40 V VCC = 80 V, VBB = 10 V, CL = 5 pF, VIN (DC) = 2.9 V, VOUT (p-p) = 50 V VCC = 80 V, VBB = 10 V, CL = 5 pF, VIN (DC) = 2.9 V, VOUT (p-p) = 40 V 13 Ratings min typ 70 65 5.8 5.0 15 25 40 30 47 17 mA mA mA mA max Unit MHz MHz ns ns
Internal Equivalent Circuit
No. 5331-2/8
VP513 Test Circuit
No. 5331-3/8
VP513
Application Circuit Examples 1. CRT neck mounted circuit
Note: 1. The matching RC circuit is used to match the IC internal impedance with the impedance of the load. In neck mounted applications, this circuit can be removed if the total load capacitance, CL, is no more than 10 pF.
2. Cable transmission (separated boards)
No. 5331-4/8
VP513 Thermal Design for the VP513 Since the VP513 includes three channels, we first consider a single channel. The chip temperature of each transistor under actual operating conditions is determined using the following formula. Tj = (Tri) = j-c (Tri) x Pc (Tri) + Tc + Ta [C] .................................. (1) j-c (Tri): Thermal resistance of an individual transistor Pc (Tri): Collector loss for an individual transistor Tc: Case temperature rise Ta: Ambient temperature The j-c(Tri) for each chip is: j-c (Tr1) = 45C/W/j-c (Tr2) to (Tr4) = 35C/W................................ (2) Although the loss for each transistor in a Video Pack varies with frequency and is not uniform, if we assume that the maximum operating frequency, f = 70 MHz (clock), then the chips with the largest loss will be transistors 3 and 4 (Tr3 and Tr4) and that loss will be about 1/4 of the total loss.Thus from the Pd for a single channel we have: Pc (Tr3) 70 MHz = Pd (1CH) 70 MHz x 1/4.......................................... (3) Here, we must select a heat sink with a capacity h such that the Tj of these transistors does not exceed 150C. Equation (4) below gives the relationship between h and Tc. Tc = Pd (TOTAL) x h ........................................................................ (4) The required h is calculated using this equation and equation (1).
No. 5331-5/8
VP513 VP513 Thermal Design Example Conditions: Using an fH = 64 kHz class monitor, fv = 70 MHz (clock) VCC = 80 V, VBB = 10 V, VOUT = 50 Vp-p (CL = 10 pF) Since this class of monitor can be operated up to Ta = 60C, here we consider the case where the maximum clock frequency is 70 MHz. As mentioned previously, the chips with the largest loss are transistors Tr3 and Tr4. Determining those values gives: Pc (Tr3) = 3.7 x 0.25 = 0.93 [W] ............................................................ (5) We determine Tj by substituting the value for j-c in equation (5). Tj = 0.93 x 35 = 32.6 [C] .................................................................... (6) Here, Tc(max) (measured at the back surface) will be under 100C, and the value in item (6) above shows that it suffices to focus on Tc(max) < 100C in the thermal design to fulfill the Tj(max) < 150C and Tc(max) < 100C conditions. Therefore, a heat sink that maintains the Tc < 100C condition will have the following thermal resistance: h = Tc / Pd (TOTAL) = (Tc - Ta) / [Pd (1CH) x 3] = 40 / (3.7 x 3) = 3.6C/W Thus the thermal resistance in this case is h = 3.6 C/W. In actual practice, the ambient temperature and operating conditions will allow a heat sink smaller than that indicated by this calculation to be used. Therefore, design optimization taking the actual conditions into account is also required.
Surge Protection Surge protection is required when this device is connected to a CRT. This product requires the same protection as earlier products. 1. Termination spark gap 2. Surge suppression resistor (Recommended value: 33 to 68 ) 3. Surge suppression diode (Installed in the vicinity of the IC output pin.) Note: Caution: The value of surge suppression resistors must be determined taking both the stipulated discharge test and the required frequency bandwidth into account.
No. 5331-6/8
VP513 Application Notes Mounting notes: Since the specified heat sink is required to operate a mounted Video Pack, we recommend the following mounting technique. (See the thermal design item for details on the required heat sink.) In particular, since the package used for this product is even more compact than that used in the earlier VPS series, the following points require special care. (These are recommendations.) 1. A tightening torque of between 0.39 and 0.88 N*m is recommended. 2. The bolt hole spacing in the heat sink should match that of the IC. In particular, the bolt hole spacing should be pulled in to be as close as possible, within the range that mounting is possible, to the dimensions A and B in the package dimensions drawing, as shown below.
3. Use either the truss screws (truss bolts) or binding screws stipulated in the JIS standards as the mounting bolts. Also, use washers to protect the IC case. 4. Foreign matter, such as machining chips, must not be left trapped between the IC case and the heat sink. If grease is applied to the junction surface, be sure to apply the grease evenly. 5. Solder the IC leads to the printed circuit board after mounting the heat sink to the IC. Note: The heat sink is absolutely required to operate this Video Pack. Never, in any situation, apply power to a Video Pack as an independent device. The Video Pack may be destroyed.
No. 5331-7/8
VP513 Peripheral wiring and ground leading: The VP513 supports standard lead forming to a zigzag 2.54 mm pitch. Also, the pin layout is standardized to the I/O and power supply line arrangement shown below.
IC Surrounding Pin Layout (Top view) Note: Design applications that use two-sided printed circuit boards or similar technologies so that input and output lines do not cross. Crossed lines can lead to increased crosstalk. Also, lines should be kept as short as possible, and the ground plane should be made as wide as possible. These layout design principles will minimize bandwidth degradation and oscillation.
s No products described or contained herein are intended for use in surgical implants, life-support systems, aerospace equipment, nuclear power control systems, vehicles, disaster/crime-prevention equipment and the like, the failure of which may directly or indirectly cause injury, death or property loss. s Anyone purchasing any products described or contained herein for an above-mentioned use shall: Accept full responsibility and indemnify and defend SANYO ELECTRIC CO., LTD., its affiliates, subsidiaries and distributors and all their officers and employees, jointly and severally, against any and all claims and litigation and all damages, cost and expenses associated with such use: Not impose any responsibility for any fault or negligence which may be cited in any such claim or litigation on SANYO ELECTRIC CO., LTD., its affiliates, subsidiaries and distributors or any of their officers and employees jointly or severally. s Information (including circuit diagrams and circuit parameters) herein is for example only; it is not guaranteed for volume production. SANYO believes information herein is accurate and reliable, but no guarantees are made or implied regarding its use or any infringements of intellectual property rights or other rights of third parties. This catalog provides information as of December, 1997. Specifications and information herein are subject to change without notice. No. 5331-8/8

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